Ball Wafer Production Line factory believes that wafer refers to the silicon wafer used to make silicon semiconductor circuits, and its raw material is silicon. High-purity polycrystalline silicon is dissolved and mixed with silicon crystal seeds, and then slowly pulled out to form cylindrical single crystal silicon. After the silicon ingot is ground, polished, and sliced, it forms a silicon wafer, that is, a wafer.

　　Ball Wafer Production Line factory believes that the main processing methods of wafers are sheet processing and batch processing, that is, processing one or more wafers at the same time. As semiconductor feature sizes become smaller and processing and measurement equipment become more advanced, new data characteristics emerge in wafer processing. At the same time, the Ball Wafer Production Line factory found that the reduction of the feature size increases the impact of the number of particles in the air on the quality and reliability of the wafer after processing, and with the improvement of cleanliness, the number of particles also appears. new data features.

　　Ball Wafer Production Line factory considers silicon wafers and silicon solar cells to be typical representatives of semiconductor materials and semiconductor devices, respectively. Semiconductor characteristic parameters measure and characterize the performance of materials and their devices. Since carriers are the functional carriers of semiconductor materials and devices, the movement of carriers forms current and electric field, and the carriers have characteristics such as light emission and thermal radiation, so the carrier parameters are used to characterize the carrier transport of semiconductor materials and devices. The basis of the characteristics, namely the carrier parameters, is an important part of the characteristic parameters of silicon wafers and silicon solar cells.